HUNTSMAN ADVANCED MATERIALS AMERICAS INC.
Patent Owner
Stats
- 126 US PATENTS IN FORCE
- 0 US APPLICATIONS PENDING
- Apr 21, 2015 most recent publication
Details
- 126 Issued Patents
- 0 Issued in last 3 years
- 0 Published in last 3 years
- 6,753 Total Citation Count
- Sep 30, 1983 Earliest Filing
- 313 Expired/Abandoned/Withdrawn Patents
Patent Activity in the Last 10 Years
Technologies
Intl Class
Technology
Matters
Rank in Class
Top Patents (by citation)
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Recent Publications
- No Recent Publications to Display
Recent Patents
Patent #
Title
Filing Date
Issue Date
Intl Class
9012543 Benzoxazine compounds derivated from phenolphthalein having flame-retardant properties and a process for their preparationSep 27, 05Apr 21, 15[C09K, C08H, C07D, C08K, H05K]
8975318 Halogen-free benzoxazine based curable compositions for high TG applicationsFeb 20, 09Mar 10, 15[C08G, C08L, C08K]
8062455 Composition comprising benzoxazine and epoxy resinMar 21, 06Nov 22, 11[C07F, C08G, C08L, B32B, C08K]
7820275 Photocurable composition for producing cured articles having high clarity and improved mechanical propertiesNov 04, 04Oct 26, 10[B32B]
7718111 Photocurable compositions for articles having stable tensile propertiesApr 11, 07May 18, 10[C08F, B29C]
7708858 Method of making high temperature resistant models or toolsNov 09, 05May 04, 10[B29C, B28B, C04B, B32B]
Expired/Abandoned/Withdrawn Patents
Patent #
Title
Status
Filing Date
Issue/Pub Date
Intl Class
8182876 Seamless model and method of making a seamless modelExpiredSep 04, 01May 22, 12[B05D, B29C, B28B, D21H]
2010/0059,174 BOROXINE DERIVATIVES AS FLAME RETARDANTAbandonedFeb 23, 06Mar 11, 10[C07F, C08K, B32B]
7488785 Impregnating reinforcing material with photopolymerizable epoxy resin compositionExpiredApr 05, 07Feb 10, 09[B05D, C08L, B32B]
2008/0200,620 Spray Polyurea System, Process for Producing and Use ThereofAbandonedJun 29, 06Aug 21, 08[C08G, C08L]
7378228 Positive type photosensitive epoxy resin composition and printed circuit board using the sameExpiredJun 21, 06May 27, 08[G03F]
7097958 Positive type photosensitive epoxy resin composition and printed circuit board using the sameExpiredNov 06, 01Aug 29, 06[G03F]
Top Inventors for This Owner
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